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GL-266B-70-2.9 Datasheet y Espec

Fabricante : National Semiconductor 

Embalaje : EBGA 

Pins : 352 

Temperatura : Min 0 °C | Max 0 °C

Tamaño : 4504 KB

Aplicación : Geode Processor Integrated x86 Solution with MMX Support 

GL-266B-70-2.9 PDF Download

GL-266B-70-2.9 PDF