Path:OKDatasheet > Datasheet Semiconductor > Power Innovations Datasheet > TISP3070H3SL
TISP3070H3SL especificación: Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
Path:OKDatasheet > Datasheet Semiconductor > Power Innovations Datasheet > TISP3070H3SL
TISP3070H3SL especificación: Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection
Fabricante : Power Innovations
Embalaje : SL
Pins : 0
Temperatura : Min 0 °C | Max 0 °C
Tamaño : 254 KB
Aplicación : Dual Symmetrical Overvoltage TISP for 3 Wire Ground Backed Ringer Protection