5962G9475403QLA especificación: Radiation Hardened PAL SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.

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5962G9475403QLA Datasheet y Espec

Fabricante : UTMC

Embalaje : DIP

Pins : 24

Temperatura : Min -55 °C | Max 125 °C

Tamaño : 315 KB

Aplicación : Radiation Hardened PAL SMD. Total dose 5E5 rads(Si). 20ns propagation delay, CMOS I/O. Class Q. Lead finish solder.